The client, a wafer die manufacturer, wanted a machine to inspect wafers for die alignment, surface defects, contamination, and dimple depths. Our machine afforded the client flexibility since it could be configured as an inline or standalone machine.
The machine must be able to detect specific size and unique patterns on the wafer. Accordingly, specially customized image processing routines had to be developed to detect and characterize the various defects and patterns found in the wafers.