Wafer Attach Machine

challenge

A leading electronic component manufacturer wanted a machine to attach components onto an integrated circuit. Each attachment of a die on a wafer had to be placed within an alignment accuracy of less than 3 microns with an expected yield of more than 99.7%, all in a cleanroom environment.

Previously, the client did not have any machine capable of the same amount of yield within the same accuracy. We had to consider every specific requirement while designing and developing the machine.

solution

Use of high-precision, high-speed cam indexer
Customized optics and vision systems to achieve high attachment speed of less than 1 second per attachment. This was coupled with less than 3μ accuracy as well as a high yield of 99.7%
Use of multiple control platform and multi-station with simultaneous action of more than 20 axes to achieve complex attachment speed
Use of OCR to automate the wafer map retrieval and update process
Replace manual handling of material with wafer-handling robot to increase productivity and reduce contamination
Flexibility of using laser curing, UV curing, or other curing processes

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outcomes and benefits

Used by leading industry players in the United States, Europe, and Singapore for high volume and quality wafer attach manufacturing, the wafer attach machine has enabled the client to achieve consistent high quality product.

Awarded the NTA (National Technology Award) in Singapore, the machine also provided high consistency in the maintenance of production yield. This meant that the cost of production was lowered since rejects and reworks were minimized to the lowest level for the client.

Award-Winning Machine Produces High-Quality Products on Three Continents

Industry

Consumer Products

Technical Capabilities

Assembly Solutions Laser Applications Material Handling Solutions Micro Precision Applications Robotics Integration Vision Applications

Region

Asia Europe North America

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